更新生产单

请求参数

Body 参数application/json

body

必需

Any of

WorkOrderCreateOrUpdateParam

null

parentCode

string

父生产单编号

可选

code

string

生产单编码

必需

assigneeType

enum<string>

必需

负责人类型
STAFF：表示人，GROUP：表示小组

枚举值:

STAFFGROUP

assigneeCode

string

负责人工号（编码）

必需

itemCode

string | null

生产物料编码

必需

configurableSpecMap

object

MapString

可选

bomVersion

string

bom版本

可选

planQty

number | null

生产物料数量

必需

>= 0.01

comment

string

生产单备注

可选

<= 140 字符

planMaterialComment

string

生产单计划用料备注

可选

<= 140 字符

startTime

integer <int64>

可选

生产单计划开始时间
为空则取当前时间

endTime

integer <int64>

可选

生产单计划结束时间
为空则取当天最晚时间

productionBatchCode

string

生产批次编码

可选

productionWarehouseCode

string

入库仓库编码

可选

routingCode

string

可选

生产工艺来源于工艺路线

productionProcessCode

string

可选

生产工艺来源于生产流程

prepareMaterialPlan

boolean

可选

是否开启备料计划 true:开启 false:关闭

默认值:

false

示例值:

false

procedures

array[object (WorpParam) {25}]

自定义生产流程

可选

prepareMaterialType

enum<string>

可选

备料方式。PREPARE_MATERIAL：备料；PICK_MATERIAL：领料

枚举值:

PREPARE_MATERIALPICK_MATERIAL

snProduction

boolean

是否开启SN生产

可选

snParallel

boolean

是否并行SN生产

可选

bindingSn

array[object (BindingSnParam) {3}]

绑定序列号

可选

planMaterials

array[object (WorpPlanMaterialParam) {15}]

计划用料

可选

backFlushMaterials

array[object (WorpBackFlushMaterialParam) {8}]

倒冲料

可选

customFields

object

MapObject

可选

示例

{
  "body": {
    "parentCode": "",
    "code": "WO-20240720-X1-001",
    "assigneeType": "GROUP",
    "assigneeCode": "WS-ASSY-004",
    "itemCode": "SMARTPHONE-X1-PLUS",
    "configurableSpecMap": {
      "thickness": "0.8±0.05mm",
      "impedance": "50Ω±5%"
    },
    "bomVersion": "BOM-2024Q3",
    "planQty": 1000,
    "comment": "华为P70主板紧急订单 | 客户PO#PO-987654",
    "planMaterialComment": "芯片需真空包装运输",
    "startTime": 1721433600000,
    "endTime": 1721865600000,
    "productionBatchCode": "BATCH-20240720-001",
    "productionWarehouseCode": "WH-SMT-ADVANCED",
    "procedureResource": "ROUTING",
    "routingProcessCode": "PR-ASSY-001-V2",
    "prepareMaterialPlan": true,
    "procedures": [],
    "prepareMaterialType": "PREPARE_MATERIAL",
    "snProduction": false,
    "snParallel": false,
    "bindingSn": [
      {
        "procedureCode": "FINAL-TEST",
        "autoGenerateSnCount": 0,
        "customSnCodes": []
      }
    ],
    "planMaterials": [
      {
        "itemCode": "IC-CHIP-5NM",
        "procedureCode": "SMT-001-V2",
        "bomVersion": "CHIP-005",
        "planQty": 180,
        "consumeType": "DEFAULT",
        
        "configurableSpecMap": {"tolerance":"±0.01mm"},
        "comment": "芯片真空包装拆封后2小时内必须使用",
        "keyMaterial": true,
        "defaultWarehouseCode": "WH-CHIP-VACUUM",
        "defaultBatchCodes": ["BATCH-20240720-5NM"],
        "replaceProductSn": false,
        "enablePrepareMaterialLimit": true,
        "itemRecognizableCode": "QR-CHIP-${BATCH}",
        "distributeOrder": "1"
      }
    ],
    "backFlushMaterials": [
      {
        "itemCode": "SOLDER-PASTE",
        "procedureCode": "SMT-001-V2",
        "bomVersion": "PASTE-003",
        "planQty": 0.25,
        "consumeType": "AUTO",
        "consumeMaterialLimitType": "WORK_ORDER",
        "configurableSpecMap": {"viscosity":"200±50Pa·s"},
        "comment": "锡膏单位：kg/千片"
      }
    ],
    "customFields": {
      "priorityLevel": "URGENT",
      "customerCode": "HW-P70"
    }
  }
}

示例代码

Shell

JavaScript

Java

Swift

PHP

Python

HTTP

Objective-C

Ruby

OCaml

Dart

curl --location --request POST 'https://sit.newcoretech.com/api/open/v3/workOrder/update' \
--header 'Content-Type: application/json' \
--data-raw '{
  "body": {
    "parentCode": "",
    "code": "WO-20240720-X1-001",
    "assigneeType": "GROUP",
    "assigneeCode": "WS-ASSY-004",
    "itemCode": "SMARTPHONE-X1-PLUS",
    "configurableSpecMap": {
      "thickness": "0.8±0.05mm",
      "impedance": "50Ω±5%"
    },
    "bomVersion": "BOM-2024Q3",
    "planQty": 1000,
    "comment": "华为P70主板紧急订单 | 客户PO#PO-987654",
    "planMaterialComment": "芯片需真空包装运输",
    "startTime": 1721433600000,
    "endTime": 1721865600000,
    "productionBatchCode": "BATCH-20240720-001",
    "productionWarehouseCode": "WH-SMT-ADVANCED",
    "procedureResource": "ROUTING",
    "routingProcessCode": "PR-ASSY-001-V2",
    "prepareMaterialPlan": true,
    "procedures": [],
    "prepareMaterialType": "PREPARE_MATERIAL",
    "snProduction": false,
    "snParallel": false,
    "bindingSn": [
      {
        "procedureCode": "FINAL-TEST",
        "autoGenerateSnCount": 0,
        "customSnCodes": []
      }
    ],
    "planMaterials": [
      {
        "itemCode": "IC-CHIP-5NM",
        "procedureCode": "SMT-001-V2",
        "bomVersion": "CHIP-005",
        "planQty": 180,
        "consumeType": "DEFAULT",
        
        "configurableSpecMap": {"tolerance":"±0.01mm"},
        "comment": "芯片真空包装拆封后2小时内必须使用",
        "keyMaterial": true,
        "defaultWarehouseCode": "WH-CHIP-VACUUM",
        "defaultBatchCodes": ["BATCH-20240720-5NM"],
        "replaceProductSn": false,
        "enablePrepareMaterialLimit": true,
        "itemRecognizableCode": "QR-CHIP-${BATCH}",
        "distributeOrder": "1"
      }
    ],
    "backFlushMaterials": [
      {
        "itemCode": "SOLDER-PASTE",
        "procedureCode": "SMT-001-V2",
        "bomVersion": "PASTE-003",
        "planQty": 0.25,
        "consumeType": "AUTO",
        "consumeMaterialLimitType": "WORK_ORDER",
        "configurableSpecMap": {"viscosity":"200±50Pa·s"},
        "comment": "锡膏单位：kg/千片"
      }
    ],
    "customFields": {
      "priorityLevel": "URGENT",
      "customerCode": "HW-P70"
    }
  }
}'

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示例代码

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